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TechnaLoc™ Bonding
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 In HP/HT (high pressure/high temperature) situations, the downhole environment becomes increasingly complex and aggressive, both chemically and mechanically. In these extreme conditions, it is difficult to maintain a strong, lasting bond between elastomers and metallic materials, such as stainless steel or nickel alloy, due to the temperature limits of conventional adhesives. Greene, Tweed's new patent-pending TechnaLoc™ bonding solution offers a stronger and more reliable bond to a wide variety of metal substrates, extending the life of sealing solutions in HP/HT applications.
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